finite element method software package comsol multiphysics version 5.6 (COMSOL Inc)
90
Structured Review
COMSOL Inc
finite element method software package comsol multiphysics version 5.6
Finite Element Method Software Package Comsol Multiphysics Version 5.6, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
https://www.bioz.com/product/finite+element+method+software+package+comsol+multiphysics+version+5%2E6/comsol+multiphysics/10__1016_slash_j__matchemphys__2022__125960-54-16-21
Average 90 stars, based on 1 article reviews
Finite Element Method Software Package Comsol Multiphysics Version 5.6, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
https://www.bioz.com/product/finite+element+method+software+package+comsol+multiphysics+version+5%2E6/comsol+multiphysics/10__1016_slash_j__matchemphys__2022__125960-54-16-21
Average 90 stars, based on 1 article reviews
finite element method software package comsol multiphysics version 5.6 - by Bioz Stars,
2026-10
90/100 stars
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Software:Article Title: Interfacial reactions at Ga-21.5In–10Sn/Cu liquid-solid interfaces under isothermal and non-isothermal conditions Article Snippet: The present work investigated the effect of isothermal and non-isothermal conditions on the interfacial reactions at Ga-21.5In–10Sn/Cu interfaces.. Increasing the isothermal temperature from 140 to 180 C, the growth mechanism of CuGa2 changed from mixed mechanism (reaction control and volume diffusion) to volume diffusion mechanism.. At higher reaction temperature such as 220 and 260 C, the growth behavior of interfacial CuGa2 was controlled by grain diffusion regime. |